Product Summary

The MC8790 is a HSPA+ embedded wireless module.

Parametrics

MC8790 absolute maximum ratings: (1)Peak Download Rate: 21.1 Mbps; (2)Peak Upload Rate: 5.76 Mbps; (3)Frequency Bands: WCDMA 850/900/1900/2100 MHz; (4)HSxPA Max: 1000mA; (5)SIM Interface: 1.8V or 3V; (6)Control Options: CnS AT commands; (7)Device Dimensions: 51 × 30 × 4.5mm; (8)Temperature Range: -25℃ to +75℃.

Features

MC8790 features: (1)HSPA+ with peak downlink speeds up to 21 Mbps and peak uplink speeds up to 5.76 Mbps; (2)Support for GPS including, Standalone, Assisted and gpsOneXtra; (3)Uses Qualcomm’s MDM8200A chipset; (4)World class product performance, quality and reliability; (5)Solid documentation, tool development and consultation services; (6)Solid support for device integration and verification; (7)Comprehensive SDK and enabling software; (8)Flexible driver strategy with NDIS support and non-NDIS abilities; (9)Includes an I2S voice interface (MC8704).